Samsung Allocates Over Half of 4nm Capacity to HBM4 Base Chips

Samsung Electronics' foundry division has allocated more than 50% of its 4nm production capacity to the mass production of base chips for the sixth-generation High Bandwidth Memory (HBM4). In the second half of this year, the division plans to dedicate over half of its 4nm wafers to HBM4 base chip manufacturing to expand supply to companies like NVIDIA, Broadcom, and AMD. Samsung initiated HBM4 mass production shipments in February this year and plans to increase supply starting in the third quarter, significantly ramping up wafer input from mid-year. The chips are based on Samsung's 4nm (SF4) foundry process. As of last month, over 50% of its total 4nm capacity has been allocated to HBM4 base chips. According to insiders, Samsung's 4nm production is currently running at full capacity, with HBM4 base chips accounting for approximately 50% to 60%, a high ratio expected to be maintained in the second half of the year. Samsung's foundry lines at Pyeongtaek Plant 2 and 3 are producing 4 to 7nm processes, with a monthly capacity of about 30,000 wafers for 4nm, estimating around 15,000 wafers per month dedicated to HBM4 base chips. During the second quarter earnings call, Samsung stated that it expects HBM4 revenue to triple in the third quarter compared to the previous quarter, with HBM4 revenue in the second half projected to exceed 60% of the company's overall HBM revenue.

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